Paper Title:
Stabilization of Nano-Al2O3p/Cu Composite after High Temperature Annealing Treatment
  Abstract

Al2O3 dispersion strengthened copper composite (Al2O3p/Cu composite) was produced by internal oxidation. The hardness and electrical conductivity of the produced Al2O3p/Cu composite (0.60 wt.% Al2O3) subjected to high temperature annealing treatments after different cold work deformations have been investigated; the microstructures of the composite have also been analyzed by TEM. Results show that the microstructure of the composite is characterized by an uniform distribution of nano-Al2O3 particles in Cu-matrix; the composite can maintain more than 91% hardness retention after 1h, 1000°C annealing treatment; the recrystallization of the Cu-matrix can be largely retarded and only partially happened even annealing for 1h at 1050°C, following cold deformation of 84%.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
993-996
DOI
10.4028/www.scientific.net/MSF.475-479.993
Citation
K. X. Song, P. Liu, B. H. Tian, Q. M. Dong, J. D. Xing, "Stabilization of Nano-Al2O3p/Cu Composite after High Temperature Annealing Treatment", Materials Science Forum, Vols. 475-479, pp. 993-996, 2005
Online since
January 2005
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$32.00
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