Paper Title:
Disorientations and Their Role on the Work-Hardening in Stage IV
  Abstract

The e ect of deformation-induced disorientations on work-hardening of metals is modelled by dislocation dynamics. By incorporating excess dislocations related to disori- entations, Kocks' dislocation model describing stage III hardening is extended to stage IV. Disorientations evolving from purely statistical reasons still lead to stage III behavior and a saturation of the ow stress, but deterministic contributions to the development of disorienta- tions, as di erences in activated slip systems across boundaries, cause a linear increase of the flow stress at large strains. Such a constant work-hardening rate is characteristic for stage IV.

  Info
Periodical
Edited by
Jaroslav Pokluda
Pages
155-158
DOI
10.4028/www.scientific.net/MSF.482.155
Citation
W. Pantleon, "Disorientations and Their Role on the Work-Hardening in Stage IV", Materials Science Forum, Vol. 482, pp. 155-158, 2005
Online since
April 2005
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Y. Sumino, H. Watanabe, Naoaki Yoshida
Abstract:In order to investigate the effect of stepwise change of irradiation temperature on pure copper, heavy ion irradiations under constant...
1479
Authors: W. Mao, Y. Li, W. Guo, Z. An
Abstract:The precipitation behaviors of fine MnS and other second phase particles in hot band, decarburized sheet and 875 oC annealed sheet before...
247
Authors: Hong Wei Ji, Huai Wen Wang
Abstract:Short span compressive experiments of molded pulp specimens were carried out on the SHIMADZU material test machine, resulting in the...
202
Authors: Wei Fu, Wan Ping Wu, Sha Wu, Bin He, Yan Bin Ruan
Abstract:Swelling tests of remolded expansive soil with water immersing are carried out by use of the simple consolidometers. The swelling...
1761
Authors: Yuan Xiang Zhang, Jun Wu, Ying Yu Ji
Abstract:This paper investigates the electromigration (EM) induced void and hillock generation in IC interconnect structures. The driving force for...
6