Paper Title:
Low Temperature Chemical Vapor Deposition of 3C-SiC on Si Substrates
  Abstract

In the present work an UHVCVD method was developed which allows the epitaxial growth of 3C-SiC on Si substrates at temperatures below 1000°C. The developed method enable the growth of low stress or nearly stress free single crystalline 3C-SiC layers on Si. The influence of hydrogen on the growth process are be discussed. The structural properties of the 3C-SiC(100) layers were studied with reflection high-energy diffraction, atomic force microscopy, X-ray diffraction and the layer thickness were measured by reflectometry as well as visible ellipsometry. The tensile strain reduction at optimized growth temperature, Si/C ratio in the gas phase and deposition rate are demonstrated by the observation of freestanding SiC cantilevers.

  Info
Periodical
Materials Science Forum (Volumes 483-485)
Edited by
Roberta Nipoti, Antonella Poggi and Andrea Scorzoni
Pages
201-204
DOI
10.4028/www.scientific.net/MSF.483-485.201
Citation
C. Förster, V. Cimalla, O. Ambacher, J. Pezoldt, "Low Temperature Chemical Vapor Deposition of 3C-SiC on Si Substrates", Materials Science Forum, Vols. 483-485, pp. 201-204, 2005
Online since
May 2005
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Price
$32.00
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