Numerical Analysis of Growth Condition on SiC-CVD in the Horizontal Hot-Wall Reactor |
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| Journal | Materials Science Forum (Volumes 483 - 485) |
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| Volume | Silicon Carbide and Related Materials 2004 |
| Edited by | Roberta Nipoti, Antonella Poggi and Andrea Scorzoni |
| Pages | 53-56 |
| DOI | 10.4028/www.scientific.net/MSF.483-485.53 |
| Citation | Shinichi Nishizawa et al., 2005, Materials Science Forum, 483-485, 53 |
| Online since | May, 2005 |
| Authors | Shinichi Nishizawa, Michel Pons |
| Keywords | Chemical Vapour Deposition (CVD), Doping, Etching, Growth Model, Growth Rate, Simulation |
| Abstract | Growth, etching, and doping features of SiC-CVD in a horizontal hot-wall reactor were numerically analyzed using the improved heterogeneous model. The improved model was able to explain the growth and etching features accurately. In addition, we propose the surface flux, surface carbon and silicon concentration, and its ratio as the universal parameter of the SiC-CVD process. Concerning doping features, the improved model showed that nitrogen and aluminum doping incorporation could be explained by the site competition model, while taking into account the amount of surface silicon and surface carbon, respectively. |
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