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Epitaxial Deposition of Silicon Carbide Films in a Horizontal Hot-Wall CVD Reactor

Journal Materials Science Forum (Volumes 483 - 485)
Volume Silicon Carbide and Related Materials 2004
Edited by Roberta Nipoti, Antonella Poggi and Andrea Scorzoni
Pages 57-60
DOI 10.4028/www.scientific.net/MSF.483-485.57
Citation Alessandro Veneroni et al., 2005, Materials Science Forum, 483-485, 57
Online since May, 2005
Authors Alessandro Veneroni, Fabrizio Omarini, Maurizio Masi, Stefano Leone, Marco Mauceri, Giuseppe Pistone, Giuseppe Abbondanza
Keywords Chemical Vapor Deposition Processes, Fluid Flow, Models of Film Growth, Semiconductor Materials, Theory of Film Growth
Abstract

The present production processes for epitaxial SiC do not allow the matching of productivity with the material quality requested by the microelectronics market. Here, to respond to such a demand, a combined experimental and multi-scale – multi-hierarchy modeling approach was adopted. Models allow to verify a priori the role of process operative parameters on the performance ones for both the final product and of the process itself, like growth rate uniformity, film stoichiometry and dopants incorporation, homogeneous nucleation of particulate, microdefects and film morphology. Specifically, in this work the developing of a lumped deposition mechanism is addressed

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