Paper Title:
Effect of the Metal Composition on the Electrical and Thermal Properties of Au/Pd/Ti/Pd Contacts to p-Type SiC
  Abstract

X-ray photoelectron spectroscopy is used to study the effect of the metal composition on the electrical and thermal properties of Au/Pd/Ti/Pd contacts to SiC. No reactions and interdiffusion between the contact components and SiC are found for the as-deposited contact layer. The steep metal/SiC interface corresponds to the Schottky behaviour observed before the annealing. Annealing at 900 oC causes Pd2Si formation at the SiC interface and ohmic properties appearance. Due to the addition of Ti to the contact composition the carbon resulting from the SiC dissociation during annealing is completely consumed, which leads to improvement of the thermal stability.

  Info
Periodical
Materials Science Forum (Volumes 483-485)
Edited by
Roberta Nipoti, Antonella Poggi and Andrea Scorzoni
Pages
749-752
DOI
10.4028/www.scientific.net/MSF.483-485.749
Citation
L. Kolaklieva, R. Kakanakov, T. Marinova, G. Lepoeva, "Effect of the Metal Composition on the Electrical and Thermal Properties of Au/Pd/Ti/Pd Contacts to p-Type SiC", Materials Science Forum, Vols. 483-485, pp. 749-752, 2005
Online since
May 2005
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