Paper Title:
Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow
  Abstract

The interfacial reaction between eutectic Sn-3.5wt.%Ag solder and Ni substrate resulted in the formation of Ni3Sn4 intermetallic compound (IMC) layer. After formation of the Ni3Sn4 IMC, its grain coarsened and faceted continuously in a prolonged reflow reaction. The thickness of the IMC layer increased with reflow time. On the other hand, the brittleness of the joints increased with increasing reflow time, and the fracture occurred at the interface. The deterioration of the shear strength was found to be predominantly caused by the formation of the thick Ni3Sn4 IMC layer.

  Info
Periodical
Materials Science Forum (Volumes 486-487)
Edited by
Hyung Sun Kim, Sang-Yeop Park, Bo Young Hur and Soo Wohn Lee
Pages
289-292
DOI
10.4028/www.scientific.net/MSF.486-487.289
Citation
J. W. Yoon, S. W. Kim, S. B. Jung, "Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow", Materials Science Forum, Vols. 486-487, pp. 289-292, 2005
Online since
June 2005
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