Paper Title:
Inter and Intra Granular Strain Analysis by Microdiffraction Kossel
  Abstract

We have developed a new convenient tool for local stress and strain analysis in the scanning electron microscope. It is based on the Kossel diffraction, physical phenomenon that is known for a long time because of its high accuracy for lattice constant determination in micron regions. The pattern is recorded on a CCD camera allowing a fast and reliable analysis. This technique has been applied to several materials. In-situ tensile tests were performed on a shape memory alloy. During loading, we observe clearly a shift of Kossel lines on the diagram, whose magnitude depends on the (hkl) crystallographic planes. The stress can be deduced from the diffracting plane strain measurement using a single crystal stress analysis.

  Info
Periodical
Materials Science Forum (Volumes 490-491)
Edited by
Sabine Denis, Takao Hanabusa, Bob Baoping He, Eric Mittemeijer, JunMa Nan, Ismail Cevdet Noyan, Berthold Scholtes, Keisuke Tanaka, KeWei Xu
Pages
159-164
DOI
10.4028/www.scientific.net/MSF.490-491.159
Citation
S. Berveiller, P. Dubos, K. Inal, A. Eberhardt, E. Patoor, "Inter and Intra Granular Strain Analysis by Microdiffraction Kossel", Materials Science Forum, Vols. 490-491, pp. 159-164, 2005
Online since
July 2005
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Price
$32.00
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