Comparative Potentiodynamic Study of Nickel and Hydrogen Underpotential Deposition at Polycrystalline Platinum Electrode in Weak Acid and Neutral Solutions

Underpotential deposition of nickel and hydrogen on polycrystalline platinum in weak acid and neutral solutions (3.5 ≤ pH ≤ 7.0), with and without Ni2+-ions, has been examined using cyclic voltammetric technique in the range of temperature from 274 to 313 K. The nickel and hydrogen ad-atom surface coverages were calculated from the voltammetric adsorption and desorption charges. The Temkin isotherm was fitted for both underpotential depositions, and thermodynamic adsorption parameters were calculated for both atoms. The value of the bonding energy between hydrogen and surface in the presence of underpotentially deposited nickel was calculated and found to amount to 287 kJ mol-1, which is 40 kJ mol-1 stronger bond than the same of pure platinum. The presence of nickel on the surface facilitates interfacial transfer of hydrogen into the metal bulk and consequent hydride formation significant in design of hydrogen based fuel cells.