Paper Title:
Nucleation and Texture Development during Dynamic Recrystallization of Copper
  Abstract

Dynamic recrystallization and texture development in polycrystalline copper have been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 0.7 within the temperature range 200°C to 600°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization in copper was initiated by the bulging of pre-existing high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM). Increasing misorientations from parent to dynamically recrystallizing grains indicated the occurrence of lattice rotations within the bulges, leading, in some cases to the formation of a HAGB behind the bulge. Discrimination between recrystallized and deformed components in material which had partially undergone dynamic recrystallization was carried out, followed by texture analysis. This revealed most of the recrystallized material to have orientations close to that of the deformed material, however, some remote orientations were observed which could not be related to the deformation texture by twin or 40° <111> relationships.

  Info
Periodical
Materials Science Forum (Volumes 495-497)
Edited by
Paul Van Houtte and Leo Kestens
Pages
1195-1200
DOI
10.4028/www.scientific.net/MSF.495-497.1195
Citation
D.T. McDonald, J. F. Humphreys, P. S. Bate, "Nucleation and Texture Development during Dynamic Recrystallization of Copper", Materials Science Forum, Vols. 495-497, pp. 1195-1200, 2005
Online since
September 2005
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Price
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