Paper Title:
Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines
  Abstract

In the present paper we report the texture and microstructure dependence of electromigration damage in Cu interconnects. This was made possible by ncorporating a sophisticated set of instrumentation within the SEM which enabled in-situ monitoring of the electromigration defects. The electron backscatter diffraction (EBSD) maps were obtained before and after the completion of the electromigration tests. Thus, by comparing the maps before and after the failure it was possible to associate the texture and microstructure with both failure sites - voids and hillocks. Results from lines down to 130 nm are included and orientation dependence of the defects is discussed.

  Info
Periodical
Materials Science Forum (Volumes 495-497)
Edited by
Paul Van Houtte and Leo Kestens
Pages
1443-1448
DOI
10.4028/www.scientific.net/MSF.495-497.1443
Citation
K. K. Mirpuri, J. A. Szpunar, "Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines ", Materials Science Forum, Vols. 495-497, pp. 1443-1448, 2005
Online since
September 2005
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Price
$32.00
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