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Application of Orientation Microscopy in SEM and TEM for the Study of Texture Formation during Recrystallisation Processes

Journal Materials Science Forum (Volumes 495 - 497)
Volume Textures of Materials - ICOTOM 14
Edited by Paul Van Houtte and Leo Kestens
Pages 3-12
DOI 10.4028/www.scientific.net/MSF.495-497.3
Citation Stefan Zaefferer, 2005, Materials Science Forum, 495-497, 3
Online since September, 2005
Authors Stefan Zaefferer
Keywords 3D-EBSD, Abnormal Grain Growth, Electron Backscatter Diffraction (EBSD), FIB, Nucleation Mechanism, Shear Band, TEM Diffraction Pattern
Abstract

Orientation microscopy in TEM and SEM is a particularly well suited tool to study recrystallisation processes because these are always associated with orientation and microstructure changes. The present work discusses the possibilities and limits of the TEM and SEM based techniques and illustrates their use by means of 3 different examples. The examples include studies on nucleation mechanisms of primary recrystallisation where the techniques meet their limits in spatial resolution. The problem of in-situ observations of annealing processes is discussed and it is shown how recrystallisation simulation techniques based on experimental data may be used. Furthermore the new technique of 3-dimensional EBSD in a focused-ion-beam (FIB) SEM is presented with one example. Finally, the statistical analysis of very large orientation data sets is discussed by an example of secondary recrystallisation in electrical steels.

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