Paper Title:
Orientation Evolution during Equal Angular Channel Extrusion of Copper Single Crystal
  Abstract

The orientation evolution in Copper single crystal during ECAE (in Route C) has been investigated experimentally for 90° die angle by X-ray diffraction and TEM-OIM. It is shown that after the previous three passes of ECAE, orientation evolutes with similar mechanism to the simple shear deformation. The grain subdivision occurs with the appearance of many low angle grain boundaries. After four times extrusions the ED of the samples remains stable, their ND rotates around the ED by about 20°. After five times extrusions the main texture component remains stable.

  Info
Periodical
Materials Science Forum (Volumes 495-497)
Edited by
Paul Van Houtte and Leo Kestens
Pages
815-820
DOI
10.4028/www.scientific.net/MSF.495-497.815
Citation
G. Wang, S. D. Wu, Q.W. Jiang, Y. D. Wang, Y. P. Zong, C. Esling, L. Zuo, "Orientation Evolution during Equal Angular Channel Extrusion of Copper Single Crystal", Materials Science Forum, Vols. 495-497, pp. 815-820, 2005
Online since
September 2005
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$32.00
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