Paper Title:
Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE
  Abstract

A submicron-grained (SMG) microstructure, with an average grain size of ~0.4 µm was produced by equal channel angular extrusion (ECAE). The SMG microstructure was composed of large dynamic recrystallized grains within a matrix of deformed elongated cells. Samples were annealed for various times at 473 K and then examined using transmission electron microscopy (TEM) and electron back scattered diffraction (EBSD). The results specify that a large recovery takes place during the first annealing times. Moreover, MET investigations show nucleation of grains which orientations are found in the recrystallized texture. The EBSD measurements established that, after 7min30s at 473 K, the microstructure is equiaxed and stable with an average grain size of about 2 µm.

  Info
Periodical
Materials Science Forum (Volumes 495-497)
Edited by
Paul Van Houtte and Leo Kestens
Pages
845-850
DOI
10.4028/www.scientific.net/MSF.495-497.845
Citation
A. L. Etter, D. Solas, T. Baudin, R. Penelle, "Evolution of Microstructure and Texture during Annealing of a Copper Processed by ECAE ", Materials Science Forum, Vols. 495-497, pp. 845-850, 2005
Online since
September 2005
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$32.00
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