Paper Title:
Deformation and Recrystallization Texture of Heavily Drawn OFHC Copper
  Abstract

Deformation and recrystallization texture has been investigated in Oxygen free high conducting (OFHC) copper wires drawn at room temperature to true strain of 2.31, and isothermally annealed at various temperatures between 150°C and 750°C. Local orientations of the microstructures were measured by means of electron backscattered diffraction (EBSD) technique. While the drawn wire was characterized by a major<111> + minor<100> duplex fiber texture, recrystallization occurred at annealing temperatures between 250°C and 400°C and resulted into a major<100>+minor<111> recrystallization texture. At temperatures above 500°C, the <100> dominated recrystallization texture changed to the <111> dominated growth texture due to secondary recrystallization, which favored the <111> orientation at the expense of the <100> component.

  Info
Periodical
Materials Science Forum (Volumes 495-497)
Edited by
Paul Van Houtte and Leo Kestens
Pages
877-882
DOI
10.4028/www.scientific.net/MSF.495-497.877
Citation
D. R. Waryoba, P. N. Kalu, "Deformation and Recrystallization Texture of Heavily Drawn OFHC Copper", Materials Science Forum, Vols. 495-497, pp. 877-882, 2005
Online since
September 2005
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Price
$32.00
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