Paper Title:
Selection of Proper Fatigue Model for Flip Chip Package Reliability
  Abstract

There have been diverse fatigue models and approaches to properly estimate solder joint reliability. However, it is one of the most difficult problems to determine which solder constitutive models and fatigue models can be applied best. In this paper, both viscoplastic and elastic-plastic-creep solder constitutive models could be utilized to calculate accumulated inelastic response under 208 K to 423 K(-65 °C to 150 °C) thermal cycling condition. And two different fatigue models, Darveaux and creep-fatigue model were applied to find solder joints fatigue life for flip chip assembly. Moreover, each fatigue life was compared to experimental result for the validation of finite element analysis. The actual number of cycles to failure was obtained from cross sectional view of the package with SEM.

  Info
Periodical
Edited by
Masaaki Naka and Toshimi Yamane
Pages
393-398
DOI
10.4028/www.scientific.net/MSF.502.393
Citation
Y. E. Shin, Y. S. Kim, H.-I. Kim, J. M. Kim, K. H. Chang, D. F. Farson, "Selection of Proper Fatigue Model for Flip Chip Package Reliability ", Materials Science Forum, Vol. 502, pp. 393-398, 2005
Online since
December 2005
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Price
$32.00
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