Paper Title:
Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint
  Abstract

Berkovich micro-indentation tests with different loading rates have been performed on the ball grid array solder joint with a Pb-free solder, Sn-4.0Ag-0.5Cu alloy. The resulting indentation load-depth curves are rate dependent and have varying creep penetration depths during the same hold time. Creep indentation hardness and rate sensitivity have been defined from the concept of “work of indentation”. The rate sensitivity of BGA solder joint is 0.0574.

  Info
Periodical
Edited by
Masaaki Naka and Toshimi Yamane
Pages
399-404
DOI
10.4028/www.scientific.net/MSF.502.399
Citation
F. J. Wang, X. Ma, Y. Qian, "Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint ", Materials Science Forum, Vol. 502, pp. 399-404, 2005
Online since
December 2005
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