Paper Title:
The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films
  Abstract

  Info
Periodical
Edited by
Masaaki Naka and Toshimi Yamane
Pages
417-424
DOI
10.4028/www.scientific.net/MSF.502.417
Citation
S. Takayama, M. Oikawa, "The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films ", Materials Science Forum, Vol. 502, pp. 417-424, 2005
Online since
December 2005
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Price
$32.00
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