A novel method for diffusion bonding metallic alloys with stable surface oxide films (e.g. nickel and cobalt base superalloys and aluminium alloys) has been developed. The stable oxides on the faying surfaces of these alloys are replaced, prior to the bonding process, with a very thin metallic layer and/or less stable oxides, using a proprietary non-chemical oxide removal method based on the use of gallium. This new method is very rapid and neither requires the use of any sophisticated equipment nor is a costly process. Bonding is then readily achieved by either solid-state or transient-liquid-phase (TLP) diffusion bonding. Using this method, bonds in nickelbase and cobalt-base superalloys with “virtually invisible” bond interfaces and bonds in aluminium alloys with strengths as high as those of the parent alloys can be produced.