Paper Title:
Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method
  Abstract

To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.

  Info
Periodical
Edited by
Masaaki Naka and Toshimi Yamane
Pages
443-448
DOI
10.4028/www.scientific.net/MSF.502.443
Citation
Y. Fukuzawa, S. Nagasawa, M. Watanabe, S. Takaoka, "Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method ", Materials Science Forum, Vol. 502, pp. 443-448, 2005
Online since
December 2005
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