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Structure and Mechanical Properties of Submicrocrystalline Copper Produced by ECAP to Very High Strains

Journal Materials Science Forum (Volumes 503 - 504)
Volume Nanomaterials by Severe Plastic Deformation
Edited by Zenji Horita
Pages 971-976
DOI 10.4028/www.scientific.net/MSF.503-504.971
Citation Alexei Vinogradov et al., 2006, Materials Science Forum, 503-504, 971
Online since January, 2006
Authors Alexei Vinogradov, T. Suzuki, Satoshi Hashimoto, Kazuo Kitagawa, A.A. Kuznetsov, Sergey V. Dobatkin
Keywords Copper (Cu), Electron Backscatter Diffraction (EBSD), Equal-Channel Angular Pressing (ECAP), Mechanical Properties, Microstructure, Thermal Stability
Abstract

The present work is aimed at linking the microstuctutral features obtained after severe plastic deformation via ECAP to the tensile behavior and thermal stability of pure (99.98%) copper processed by routes A and Bc to different number of passes. The main conclusion one can draw unambiguously from the currently available results is that the strain path exerts relatively little effect on the resultant tensile properties when the number of pressing is sufficiently large, although there have been some marked differences in crystallographic textures and distribution of grain-boundaries. The effect of the number of pressings on the tensile ductility is considerable.

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