Paper Title:
Using the Hot Embossing Technology to Fabricate the Movable Component on Polymer Material
  Abstract

It presented a novel manufacturing method that was derived from traditional hot embossing technology to fabricate actuators on polymer material in this paper. The conventional photolithography technology, electroplating, and hot embossing technology were utilized in this process. The plastic deformation properties of thermoplastic polymers were main concept. The metal layer deposited on the silicon wafer could be embedded into the polymer substrate by hot embossing technology as temperature being above Tg. When the polymer substrate temperature was cooled below the Tg, the polymer is to de-embossing and remove silicon wafer. The metal layer was transferred from silicon wafer to be embedded in the polymer substrate. Owing to the adhesion between the metal layer and polymer material was more than the metal layer and silicon wafer. For instance, the PMMA was employed as the polymer substrate to fabricate the cantilever beam actuator using the novel technology. Finally, the beam was driven by electrostatic force through 25volts of DC power.

  Info
Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
103-108
DOI
10.4028/www.scientific.net/MSF.505-507.103
Citation
C. H. Chien, H. M. Yu, "Using the Hot Embossing Technology to Fabricate the Movable Component on Polymer Material", Materials Science Forum, Vols. 505-507, pp. 103-108, 2006
Online since
January 2006
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Price
$32.00
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