Paper Title:
Fabrication of Micro Components to Silicon Wafer Using EDM Process
  Abstract

In this paper, the machining possibilities of silicon wafers by the EDM process are described. Micro components of silicon wafer were processed by EDM process. A fine tungsten carbide rod was machined as tool electrode for EDM process. Performance was investigated utilizing serious experiments. Micro hole was process with the fine electrode using EDM drilling. Micro slots were also processed on the surface of a silicon plate by a copper section electrode. The surface roughness of the silicon wafers in the EDM process was investigated. Array-micro-hole was machined by a tungsten carbide multi-electrode. Array micro holes on the coaxial circle were processed by a graphite-copper electrode of Dia.0.45mm. Batch production technology for economical EDM machining of micro holes were proposed.

  Info
Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
217-222
DOI
10.4028/www.scientific.net/MSF.505-507.217
Citation
F. T. Weng, C. S. Hsu, W. F. Lin, "Fabrication of Micro Components to Silicon Wafer Using EDM Process", Materials Science Forum, Vols. 505-507, pp. 217-222, 2006
Online since
January 2006
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Price
$32.00
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