Paper Title:
Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System in Package with Polymer-Based Material
  Abstract

This paper demonstrates the thermal-induced mechanical problems resulted from various temperature profiles of reliability test for a system-in-package (SIP) assembly process. The package includes two flip chip mounted chips (underfilled), two memory CSPs, some passive SMDs and 4-layer BT substrate. The flip-chip specimen was taken and the Moiré Interferometry was used as methodology to verify the developed Finite Element Model and material property. It also shows that the developed finite element model is capable to simulate the JEDEC standard JESD22-A104 reliability thermal cycle test and then to predict solder fatigue life and to summarize design rules for thermal optimization of package based on the creep model and viscoplastic model of solder while the SIP package design is proceeded. Thermal design for SIP depends on the placement of FC chip (high power) and memory CSP components. Passive SMDs are also included to study the effect of thermal-induced stress. A series of comprehensive parametric studies were conducted in this paper.

  Info
Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
289-294
DOI
10.4028/www.scientific.net/MSF.505-507.289
Citation
H. C. Hsu, W. M. Hung, "Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System in Package with Polymer-Based Material", Materials Science Forum, Vols. 505-507, pp. 289-294, 2006
Online since
January 2006
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Kenji Machida, Mitsuru Sato, Shinji Ogihara
Abstract:Fiber reinforced composites are heterogeneous and anisotropic. The applicability of the stress analysis methods on such heterogeneous and...
1121
Authors: Pablo Lopez-Crespo, Daniel Camas, Antonio González-Herrera, J.R. Yates, Eann A Patterson, Jose Zapatero
Abstract:The fatigue life of metallic materials is strongly influenced by crack closure effects. Finite element (FE) methods allow the study of crack...
369
Authors: Hong Shuang Zhang
Abstract:The hole cold expansion is a well-known technique used to improve the fatigue life in mechanical structures. An approach named simulation...
373
Authors: Gyun Lee, Hyo Sun Yu, Sung Mo Yang, Hee Yong Kang, Dong Pyo Hong, Joon Hyuk Song
Chapter 07: Applied Chemistry
Abstract:The use of Pb-free solder alloys are just newly developed materials and their properties are not well established and documented yet. So, the...
694
Authors: Jing Luo, Mutellip Ahmat, Qiang Gao, Li Chao Ren
Chapter 2: Mechanical Engineering and Engineering Design
Abstract:In this paper, the precise 3D model of the wind power increasing gear was set up by based on the parametric designing method of Pro/Program,...
447