Paper Title:
Study on Indentation-Sliding Contact Conditions between Semiconductor Terminal and Electrically Testing Probes
  Abstract

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Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
295-300
DOI
10.4028/www.scientific.net/MSF.505-507.295
Citation
H. Saiki, Y. Marumo, L. Q. Ruan, R. Haraguchi, M. Moriyama, "Study on Indentation-Sliding Contact Conditions between Semiconductor Terminal and Electrically Testing Probes", Materials Science Forum, Vols. 505-507, pp. 295-300, 2006
Online since
January 2006
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Price
$32.00
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