Paper Title:
An Experimental Study on the Effects of Abrasive Particle Sizes on Polishing Phenomena
  Abstract

The effects of abrasive particle size on polishing phenomena during wafer planarization are investigated using a high precision polishing process test bench with in-situ measurement technology. The present experimental results are found to be comported with the experimental and theoretical data published previously. The current experimental outcomes can help to understand the polishing mechanism and develop the relating theoretical model.

  Info
Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
301-306
DOI
10.4028/www.scientific.net/MSF.505-507.301
Citation
Y. R. Jeng, P. Y. Huang, "An Experimental Study on the Effects of Abrasive Particle Sizes on Polishing Phenomena", Materials Science Forum, Vols. 505-507, pp. 301-306, 2006
Online since
January 2006
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Price
$32.00
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