Paper Title:
A Time Optimized Process Planning System for Mold/Die Polishing
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
499-504
DOI
10.4028/www.scientific.net/MSF.505-507.499
Citation
J. J. Wang, B. H. Wu, J. K. Hou, "A Time Optimized Process Planning System for Mold/Die Polishing", Materials Science Forum, Vols. 505-507, pp. 499-504, 2006
Online since
January 2006
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Price
$32.00
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