Paper Title:
Studies on CCD On-Line Detection in Curve Grinding
  Abstract

An on-line image measurement system for curve grinding was schemed out according to the working process. Because of interaction between detection precision and field of view, it is difficult to realize high detection precision at a large field of view. In order to settle this problem, a detection method based on circular tolerance zone was presented according to grinding process and wheel shape. Real-time images of work piece can be gathered while using synchronal control and outer trigger technology. Using curve fitting method, the work piece image edge can be located to sub-pixel values. Experiments show that the proposed method in this paper is effective, and its detection precision and results are reasonable.

  Info
Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
607-612
DOI
10.4028/www.scientific.net/MSF.505-507.607
Citation
Y. H. Zhang, H. Q. Tang, Q. L. Bu, D. J. Hu, "Studies on CCD On-Line Detection in Curve Grinding", Materials Science Forum, Vols. 505-507, pp. 607-612, 2006
Online since
January 2006
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Berend Denkena, J. Jacobsen, Niklas Kramer
Abstract:In modern grinding processes the field of application for vitrified bonded wheels is constantly increasing. Regarding the grinding itself,...
195
Authors: Xin Cheng Tian, Xiao Hong Deng
Abstract:Most of the commenly adotped interpolation algorithems are for the curve machining on CNC machine tools with Cartesian coordinates...
2007
Authors: Ya Dong Gong, Jian Qiu, Yue Ming Liu, Jun Cheng
Abstract:Super high-speed point grinding is a good performance grinding with high surface quality due to its low force. To model point grinding forces...
47
Authors: Shang Gao, Ren Ke Kang, Dong Ming Guo, Quan Sheng Huang
Abstract:Using the cross-section angle polishing microscopy, the subsurface damage of the silicon wafers (100) ground by the diamond wheels with...
113
Authors: Li Jun Li, Y. Jiang, Fei Hu Zhang
Abstract:The manufacturing system developed in this paper is mainly used for the ultra-precision grinding of the hard-cutting materials, such as high...
500