Paper Title:
The Characteristic of Abrasive Particle in Chemical – Mechanical Polishing
  Abstract

Chemical Mechanical Polishing (CMP) is the key technique for wafer global planarization. However, the characteristic of abrasive particle, including particle size and grain/grain collision elasticity, plays an important role in CMP process. This investigation analyzes the slurry flow between the wafer and pad using a grain flow model with partial hydrodynamic lubrication theory. This model predicts the film thickness and remove rate of the slurry flow under a variety of the CMP parameters including load, rotation speed, pad roughness, grain/grain collision elasticity and grain size. The theoretical results compare well with the previous experiment data. This study elucidates the grain characteristics during CMP process. It also contributes to the understanding of abrasive particle effects in the chemical mechanical polishing mechanism.

  Info
Periodical
Materials Science Forum (Volumes 505-507)
Edited by
Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng
Pages
805-810
DOI
10.4028/www.scientific.net/MSF.505-507.805
Citation
H. J. Tsai, C.C. Chang, Y.R. Jeng, S. L. Chen, "The Characteristic of Abrasive Particle in Chemical – Mechanical Polishing", Materials Science Forum, Vols. 505-507, pp. 805-810, 2006
Online since
January 2006
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$32.00
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