Paper Title:
Segregation Profiles in Diffusion Soldered Ni/Al/Ni Interconnections
  Abstract

An Al foil of 25 µm thickness was used to produce a Ni/Al/Ni interconnection under isothermal conditions at 680°C. After dissolution of the Al filler metal in the Ni substrate, and Ni from the substrate in the Al liquid foil, a solidification process occurred. First of all, the solidification was stopped just at the disappearance of the Al liquid metal, but also at different steps of the progress of solidification. Sub-layers of the two phases Al3Ni2 and Al3Ni were revealed within the frozen joints. A solidification - segregation model was developed to describe the formation of the sub-layers of both mentioned phases. The model is able to predict solute segregation profiles across the sub-layers of the Ni/Al/Ni interconnection, taking into account a superposition of some phenomena like partitioning, back-diffusion into the solid and peritectic reactions. The value of the diffusion coefficient into the solid for the Al3Ni2 phase formation in the presence of the liquid is also estimated.

  Info
Periodical
Edited by
A Roósz, M. Rettenmayr and Z. Gácsi
Pages
385-392
DOI
10.4028/www.scientific.net/MSF.508.385
Citation
W. Wołczyński, J. Kloch, J. Janczak-Rusch, K. J. Kurzydłowski, T. Okane, "Segregation Profiles in Diffusion Soldered Ni/Al/Ni Interconnections", Materials Science Forum, Vol. 508, pp. 385-392, 2006
Online since
March 2006
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$32.00
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