Paper Title:
High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo
  Abstract

The interfaces formed between vitreous or thermally devitrified fused quartz substrates and silver alloys after 90 min at 850 °C in vacuum have been characterized. Three silver alloys have been used: Cusil (Ag–28 wt % Cu), Cusil-ABA (Ag–35 wt % Cu–1.5 wt % Ti), and Incusil-ABA (Ag–27 wt % Cu–12 wt % In–2 wt % Ti). A non wetting condition is found for the Cusil alloy in both substrates. In contrast, the formation of Ti5Si3, Cu3Ti3O and Ti2O3, following the sequence SiO2 → Ti2O3 → Ti5Si3 → Cu3Ti3O, is observed at the metal/ceramic interface for the two titaniumcontaining alloys on both substrates. Ti2O3 is commonly found as small particles dispersed in a silver-rich matrix. During the experiments, the reaction product layers detach from the ceramic surface and float away from the ceramic/metal interface due to their relatively low density with respect to the liquid alloy. The formation of the phases detected at the ceramic/metal interface can be explained in terms of their relative thermodynamic stability.

  Info
Periodical
Edited by
H. Balmori-Ramírez, M. Brito, J.G. Cabañas-Moreno, H.A. Calderón-Benavides, K. Ishizaki and A. Salinas-Rodríguez
Pages
117-122
DOI
10.4028/www.scientific.net/MSF.509.117
Citation
J. López-Cuevas, C. A. Gutiérrez, M. I. Pech-Canul, M. Castro-Román, J. C. Rendón-Angeles, "High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo", Materials Science Forum, Vol. 509, pp. 117-122, 2006
Online since
March 2006
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