Surface Strengthening of Polymer Micromold Using Electroless Ni-P Deposition |
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| Journal | Materials Science Forum (Volumes 510 - 511) |
|---|---|
| Volume | Eco-Materials Processing & Design VII |
| Edited by | Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee |
| Pages | 1138-1141 |
| DOI | 10.4028/www.scientific.net/MSF.510-511.1138 |
| Citation | Jae Woong Choi et al., 2006, Materials Science Forum, 510-511, 1138 |
| Online since | March, 2006 |
| Authors | Jae Woong Choi, Seok Jun Hong, Gil Ho Hwang, Sung Goon Kang |
| Keywords | Electroless Ni-P Deposition, Micro Injection Moulding, Micromold, Surface Strengthening |
| Abstract | In this work, we made micromolds using SU-8 photoresist and adopted electroless Ni-P deposition, well known as a hard coating material, to improve the rigidity and durability of SU-8 micromolds. After a micromold using SU-8 was defined by conventional lithography, Ni-P layer was electrolessly deposited on SU-8. By means of electroless Ni-P deposition, it was possible to increase the hardness of a micromold as much as about 17 times. In addition, it will be able to make various sized micromolds with one photomask by regulating the thickness of Ni-P layer. |
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