Paper Title:
Surface Strengthening of Polymer Micromold Using Electroless Ni-P Deposition
  Abstract

In this work, we made micromolds using SU-8 photoresist and adopted electroless Ni-P deposition, well known as a hard coating material, to improve the rigidity and durability of SU-8 micromolds. After a micromold using SU-8 was defined by conventional lithography, Ni-P layer was electrolessly deposited on SU-8. By means of electroless Ni-P deposition, it was possible to increase the hardness of a micromold as much as about 17 times. In addition, it will be able to make various sized micromolds with one photomask by regulating the thickness of Ni-P layer.

  Info
Periodical
Materials Science Forum (Volumes 510-511)
Edited by
Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee
Pages
1138-1141
DOI
10.4028/www.scientific.net/MSF.510-511.1138
Citation
J. W. Choi, S. J. Hong, G. H. Hwang, S. G. Kang, "Surface Strengthening of Polymer Micromold Using Electroless Ni-P Deposition", Materials Science Forum, Vols. 510-511, pp. 1138-1141, 2006
Online since
March 2006
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Price
$32.00
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