Paper Title:
A Simple Reliable Method of Selecting Epoxy Molding Compounds for High Power Short Wavelength Light Emitting Diode Packages
  Abstract

Epoxy molding compounds (EMC) with higher thermal stabilities are urgently needed as the light emitting diode (LED) becomes brighter and the wavelength of the its light becomes shorter. This paper proposes a simple reliable method of evaluating the thermal stabilities of commercial EMCs. The transmittances of most commercial EMC samples for high power short wavelength LED packages were decreased by heat treatment at 150oC for 200hr. Also the thermal stabilities of the samples were confirmed by measuring the weight losses through TGA. The experimental results suggest that employing a good heatsink is indispensable in highly bright short wavelength LED packages.

  Info
Periodical
Materials Science Forum (Volumes 510-511)
Edited by
Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee
Pages
154-157
DOI
10.4028/www.scientific.net/MSF.510-511.154
Citation
C. M. Lee, S. M. Kang, K. B. Yim, S. J. Kim, H. W. Kim, "A Simple Reliable Method of Selecting Epoxy Molding Compounds for High Power Short Wavelength Light Emitting Diode Packages", Materials Science Forum, Vols. 510-511, pp. 154-157, 2006
Online since
March 2006
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