Paper Title:

Effect of Indium on Bonding between Porcelain and Au-Pt-Cu Alloy

Periodical Materials Science Forum (Volumes 510 - 511)
Main Theme Eco-Materials Processing & Design VII
Edited by Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee
Pages 282-285
DOI 10.4028/www.scientific.net/MSF.510-511.282
Citation S.H. Lee et al., 2006, Materials Science Forum, 510-511, 282
Online since March, 2006
Authors S.H. Lee, H.Y. Jung, Jung Mann Doh, Jin Kook Yoon, H.N. Lim
Keywords Au-Pt-Cu Alloy, Bonding Strength, In2O3 Oxide, Interfacial Microstructure, Porcelain
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Abstract

Effects of 0.5 wt% Indium addition on the oxidation of Au-Pt-Cu alloy, the interfacial microstructure and bonding strength between porcelain and Au-Pt-Cu-xIn alloys(x = 0, 0.5wt%) were investigated using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, and a tensile tester. The bonding strength of the Au-Pt-Cu and Au-Pt-Cu-0.5In alloys with porcelain was about 24.6 MPa and 49.5 MPa in average, respectively. This higher bonding strength in the Au-Pt-Cu-0.5In alloy compared with the Au-Pt-Cu alloy without In is ascribed to the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy. Especially, the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy leads to enhancing chemical bonding between In2O3 and various oxides in porcelain, and also to improving the anchoring effect.