Paper Title:
Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength
  Abstract

The effects of void formation on the joint strength and failure mode of the solder joints were examined. A computational modeling technique, i.e., finite element modeling, was employed to investigate the effects. The effects of location, size and number of void were also investigated and compared with the case that has no void in the solder ball. When there was 1 or more voids in the solder ball, the joint strength decreased regardless of the location, size, and number of voids. Especially, the shear force of the joints decreased about 50% when 3 voids were formed in the solder ball. From the stress analyses, the possibility of preliminary brittle interfacial failure should be lower when voids were formed in the solder ball.

  Info
Periodical
Materials Science Forum (Volumes 510-511)
Edited by
Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee
Pages
546-549
DOI
10.4028/www.scientific.net/MSF.510-511.546
Citation
J. W. Kim, S. B. Jung, "Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength", Materials Science Forum, Vols. 510-511, pp. 546-549, 2006
Online since
March 2006
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Price
$32.00
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