Paper Title:
TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate
  Abstract

The interfacial reaction between eutectic Sn-3.5Ag solder and ENIG substrate during reflow was investigated. During the reflow, the topmost Au layer dissolved into the molten solder, and the reaction layers of Ni3Sn4/Ni-Sn-P/Ni3P formed between Sn-Ag solder and Ni-P plating layer. After the reflow at 255 for 3 min, most of Ni3Sn4 intermetallic compound (IMC) spalled off the substrate. The formation of thick Ni3P and Ni-Sn-P layers was related to the direct reaction between solder and Ni-Sn-P layer by the IMC spalling.

  Info
Periodical
Materials Science Forum (Volumes 510-511)
Edited by
Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee
Pages
554-557
DOI
10.4028/www.scientific.net/MSF.510-511.554
Citation
J. W. Yoon, S. B. Jung, "TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate", Materials Science Forum, Vols. 510-511, pp. 554-557, 2006
Online since
March 2006
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