Paper Title:
Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection
  Abstract

The novel selective interconnection using the resin containing low-melting-point-alloy fillers was developed as a high density assembly method of a low-temperature and highly reliable electronic interconnection. By means of the coalescence of fillers and wetting onto the terminal material due to the Laplace pressure of the fillers, self-organization onto the terminals was formed. The influence of the filler volume ratio and resin viscosity on the self-organized interconnecting was investigated by the numerical analysis with a multi-filler dispersion model corresponding to a real process, and was evaluated by using the normalized parameter (self-organization ratio). We clarified the existence of the optimal value of the filler volume ratio. The rate controlling factor transferred from the filler volume to the inflow velocity by the increase of the viscosity.

  Info
Periodical
Edited by
Yukichi Umakoshi and Shinji Fujimoto
Pages
367-372
DOI
10.4028/www.scientific.net/MSF.512.367
Citation
K. Yasuda, K. Ohta, K. Fujimoto, "Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection", Materials Science Forum, Vol. 512, pp. 367-372, 2006
Online since
April 2006
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