The novel selective interconnection using the resin containing low-melting-point-alloy fillers was developed as a high density assembly method of a low-temperature and highly reliable electronic interconnection. By means of the coalescence of fillers and wetting onto the terminal material due to the Laplace pressure of the fillers, self-organization onto the terminals was formed. The influence of the filler volume ratio and resin viscosity on the self-organized interconnecting was investigated by the numerical analysis with a multi-filler dispersion model corresponding to a real process, and was evaluated by using the normalized parameter (self-organization ratio). We clarified the existence of the optimal value of the filler volume ratio. The rate controlling factor transferred from the filler volume to the inflow velocity by the increase of the viscosity.