Paper Title:
Joining of Gamma-Based Titanium Aluminides – A Review
  Abstract

The optimisation of joining technologies is essential to the application of advanced materials in the design of parts and devices. The development of intermetallic compounds, as structural materials, inevitably requires a new approach to join these compounds to themselves or to other materials. Among different intermetallic classes, titanium aluminides are one of the most studied. However, the industrial application is far from being proportional to the research, due to different problems, where joining processes have an important role. The present paper highlights the state of art on joining γ-TiAl alloys. A review is presented with special emphasis on solid-state diffusion bonding process, because it seems to be the most suitable technique to produce high quality joints of advanced materials. The influence of the bonding conditions on the physical and mechanical properties of the joints is highlighted and the introduction of single or multiple interlayers to assist in the bonding process is discussed. A novel approach developed by the authors to the solid-state diffusion bonding of γ-TiAl alloys using Ti/Al multilayer thin films as bonding materials is proposed. The improvement of the solid-state diffusion bonding will induce sound joints at lower temperatures or pressures.

  Info
Periodical
Materials Science Forum (Volumes 514-516)
Edited by
Paula Maria Vilarinho
Pages
483-489
DOI
10.4028/www.scientific.net/MSF.514-516.483
Citation
A. S. Ramos, M. T. Vieira, M. F. Vieira, F. Viana, "Joining of Gamma-Based Titanium Aluminides – A Review", Materials Science Forum, Vols. 514-516, pp. 483-489, 2006
Online since
May 2006
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Young Sup Lee, Cheol Ho Lim, C.H. Lee, K.W. Seo, Seung Y. Shin, Chang Hee Lee
Abstract:In this study, a diffusion bonding of aluminium alloy A6061 was preformed using an Ag-28Cu filler metal in order to conduct eutectic...
2772
Authors: Akio Nishimoto, Katsuya Akamatsu
Abstract:Pulsed electric current sintering (PECS) was applied to the bonding of W (tungsten) to Cu (copper) using Nb or Ni powder as an intermediate...
289
Authors: José Lemus-Ruiz, Ana L. Salas-Villaseñor, Osvaldo Flores
Abstract:Solid-state direct diffusion bonding between commercially pure nickel and tungsten carbide (with 6%Cobalt) has been carried out in the...
127
Authors: Li Ping Shi, Ye Sheng Zhong, Jia Yu, Xiao Dong He
Abstract:Ti3SiC2 is one of the nano-layered ternary ceramics Mn+1AXn, where M is a transition metal, A is an A-group (mostly IIIA or IVA) element, and...
226
Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
Chapter 1: Materials Engineering. Technologies and Processing
Abstract:Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and...
44