Paper Title:
Plastic Behaviour of Copper Polycrystal Subjected to Fatigue-Tension Sequential Loading Tests
  Abstract

Sequences of fatigue-tension tests were performed on copper polycrystal sheet, with 32µm mean grain size. The effect of strain path change on subsequent reloading yield stress as well as work hardening rate has been investigated. Dislocation microstructure was observed by transmission electron microscopy after mechanical tests. Under present conditions, it was found that fatigue prestraining caused the increase of reloading yield stress, larger amplitude of strain path change resulted in higher reloading yield stress and lower work hardening rate. Reloading tensile curves are independent of predeformation plastic strain amplitudes in both cases. Many isolated dislocation lines between cell walls have been detected for Φ=0° case when the subsequent tension strain amount is 5%, this can be well understood from the microscopic dislocation slip mechanisms. When the reloading tension tests have been done until rupture, dislocation structures become typical of monotonic tension without preloading. The correlation of mechanical properties and microstructural observations was discussed in this paper.

  Info
Periodical
Materials Science Forum (Volumes 514-516)
Edited by
Paula Maria Vilarinho
Pages
897-900
DOI
10.4028/www.scientific.net/MSF.514-516.897
Citation
W. P. Jia, J. V. Fernandes, "Plastic Behaviour of Copper Polycrystal Subjected to Fatigue-Tension Sequential Loading Tests", Materials Science Forum, Vols. 514-516, pp. 897-900, 2006
Online since
May 2006
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Price
$32.00
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