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Authors: Rozidawati Awang, Goh Boon Tong, Siti Meriam Ab. Gani, Richard Ritikos, Saadah Abdul Rahman
Abstract:A direct-current plasma enhanced chemical vapour deposition (PECVD) system was designed and built in-house for the deposition of...
81
Authors: Tan Winie, S.R. Majid, M.F. Hassan, A.K. Arof
Abstract:Hexanoyl chitosan that exhibited solubility in THF was prepared by acyl modification of chitosan. Films of hexanoyl chitosan-based polymer...
85
Authors: M.F. Hassan, N.H. Idris, S.R. Majid, Tan Winie, A.S.A. Khiar, A.K. Arof
Abstract:The plasticized PEO-KOH films have been investigated using the electrochemical impedance spectroscopy (EIS), X-ray diffraction (XRD) and...
89
Authors: O.J. Lee, S.A. Halim, K.P. Lim, Z.A. Talib, A. Huda, I. Priscilla
Abstract:The significant influences of substituting low concentration Dy at La- site for La0.667Sr0.333MnO3 perovskites compounds in structural,...
93
Authors: M.I.N. Isa, S.R. Majid, A.K. Arof
Abstract:A gel electrolyte system was prepared by dissolving poly(methyl methacrylate) in ethylene carbonate and propylene carbonate doped with...
97
Authors: Siti Aishah Hashim Ali
Abstract:A mathematical model for the transport in cathode of a lithium-ion cell is developed and analytical solutions to the model equations are...
101
Authors: Abdul Hadi, Iskandar Idris Yaacob, Cheah Seok Gaik
Abstract:Nanocrystalline cerium dioxide (CeO2) has been successfully synthesized by mechanochemical technique at 12, 24, 36, 48 and 60 hours milling...
105
Authors: B. Vengadaesvaran, R. Puteh, A.K. Arof
Abstract:Silicone modified acrylic polymer dispersion was prepared by blending methoxy functional silicone intermediate resin with acrylic polyol...
111
Authors: Mohd Ambar Yarmo, Raja Saadiah Raja Shariff, Siti Rohaya Omar, Juan Joon Ching, Roziana Haron
Abstract:This paper will review on the latest development on solid acid catalysts used in industries as well in research activities. Application of...
117
Authors: Shahrul Nizam Shahdan, Azman Jalar, Muhammad Azmi Abd Hamid
Abstract:A tin-lead solder is generally used to mount an electronic package on to a printed circuit board (PCB) of an electronic devices. In this...
123
Showing 21 to 30 of 61 Paper Titles