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Modeling of a Plasma Etcher for Charging Free Processing of Nanoscale Structures

Journal Materials Science Forum (Volume 518)
Volume Recent Developments in Advanced Materials and Processes
Edited by Dragan P. Uskokovic, Slobodan K. Milonjic and Dejan I. Rakovic
Pages 57-62
DOI 10.4028/www.scientific.net/MSF.518.57
Citation M. Radmilović-Radjenović et al., 2006, Materials Science Forum, 518, 57
Online since July, 2006
Authors M. Radmilović-Radjenović, Aleksandra Nina, A. Strinić, V. Stojanović, Željka Nikitović, G.N. Malović, Z.Lj. Petrović
Keywords Charging Damage, Etching, Nanoscale Device, Neutralization Efficiency, Ultra Large Scale Integrated Technologies
Abstract

Neutral beam etching is proposed as a candidate for reducing plasma-process-induced damage in nanoscale devices. In this paper, neutralization of ion beams due to both gas phase collisions and ion surface interactions based on a PIC (Particle in Cell) simulation of realistic Capacitively Coupled Plasma is presented. It was found that a satisfactory degree of neutralization might be achieved by a combined effect of charge transfer and surface collisions.

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