Trace Element Effects on Microstructure and Mechanical Properties in Al-Cu-Li Alloy after Thermal Exposure |
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| Journal | Materials Science Forum (Volumes 519 - 521) |
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| Volume | Aluminium Alloys 2006 - ICAA10 |
| Edited by | W.J. Poole, M.A. Wells and D.J. Lloyd |
| Pages | 1931-1936 |
| DOI | 10.4028/www.scientific.net/MSF.519-521.1931 |
| Citation | Zi Qiao Zheng et al., 2006, Materials Science Forum, 519-521, 1931 |
| Online since | July, 2006 |
| Authors | Zi Qiao Zheng, X.Z. Chen, Zhi Guo Chen, S.C. Li, Xiu Yu Wei |
| Keywords | Ag, Al-Li, Ce, Microstructure, Thermal Exposure |
| Abstract | The effects of trace Ce, Ag on the microstructure and mechanical properties of Al-Cu-Li alloy after thermal exposure have been investigated. It’s found that the addition of Ce may lead to a slight increase in mechanical properties after thermal exposure at 107 . The stability of T1 phase is enhanced by independent Ag addition and the combined additions of Ag and Ce,which results in higher strength compared with Ag-free alloy at 150 thermal exposure. However, at 200 exposure, a great number of q¢ precipitates at the expense of T1 may be responsible for higher tensile strength in the Ag-free alloy than that of the independent addition of Ag and combined additions of Ag and Ce alloys. |
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