The Importance of Residual Stresses in Microelectronic Products and Materials
|
| Journal |
Materials Science Forum (Volumes 524 - 525) |
| Volume |
Residual Stresses VII |
| Edited by |
W. Reimers and S. Quander |
| Pages |
1-10 |
| DOI |
10.4028/www.scientific.net/MSF.524-525.1 |
| Online since |
September, 2006 |
| Authors |
Wolfgang H. Müller
|
| Keywords |
Coffin Manson Law, Delamination, Fatigue, Finite Element Analysis (FEA), Leadfree Solders, Microstructural Change, Phase Field Models, Surface Mount Technology |
| Abstract |
In this paper we will discuss the impact of residual stresses on the reliability of microelectronic
components and the materials used therein. The following issues will be particularly emphasized:
First, the tendency toward delamination and subsequent cracking along interfaces, such as between
silicon dies, organic substrates, glues, and underfill material; second, the fatigue of electrolytically
deposited copper vias within the substrate and FR4 board material; third, the accumulation of
irreversibly accumulated plastic (creep) strain in lead containing as well as leadfree solders; the microstructural
change observed during thermo-mechanical use within the bulk as well as at the interface of
solder interconnects. We will present state-of-the-art numerical techniques that allow to quantify the
development of stresses and strains within the aforementioned materials, mostly by finite element
analysis, as well as the coupling between local stresses and diffusion processes, which is theoretically
based on phase field models. Further emphasis is put on proper knowledge and determination of the
inherent material parameters and how theoretical predictions can be linked to and validated by experimental
observations and facts. |
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