Paper Title:
Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope
  Abstract

A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses on the micron scale, using a one cubic micrometer spot. The experimental Kossel line patterns are obtained by way of a CCD camera and are then fully indexed using a home-made simulation program. The so-determined orientation is compared with Electron Back-Scattered Diffraction (EBSD) results, and in-situ tests are performed inside the SEM using a tensile/compressive machine. The aim is to verify a 50MPa stress sensitivity for this technique and to take advantage from this microscope environment to associate microstructure observations (slip lines, particle decohesion, crack initiation) with determined stress analyses.

  Info
Periodical
Materials Science Forum (Volumes 524-525)
Edited by
W. Reimers and S. Quander
Pages
109-114
DOI
10.4028/www.scientific.net/MSF.524-525.109
Citation
R. Pesci, K. Inal, S. Berveiller, E. Patoor, J. S. Lecomte, A. Eberhardt, "Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope ", Materials Science Forum, Vols. 524-525, pp. 109-114, 2006
Online since
September 2006
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$32.00
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