Paper Title:
Residual Stresses Gradient Determination in Cu Thin Films
  Abstract

The non-destructive analysis by GIXRD allows us to determine the residual stress distribution as a function of XRD penetration depth and film thickness. A new development on the determination of residual stresses distribution is presented here. The procedure, based on the GIXRD geometry (referred to here as the ‘sin2ψ*’), enables non-destructive measurement of stresses gradient with only one diffraction family plan at a chosen depth taking into account the correction of measured direction. The chosen penetration depth is well defined for different combination of ψ and Φ and needs not to be changed during experimentation. This method was applied for measurement of residual stress gradient in Cu thin films. The obtained residual stress levels and their distribution were quite comparable with those determined by another multi-reflection method.

  Info
Periodical
Materials Science Forum (Volumes 524-525)
Edited by
W. Reimers and S. Quander
Pages
595-600
DOI
10.4028/www.scientific.net/MSF.524-525.595
Citation
J. Peng, V. Ji, J. M. Zhang, W. Seiler, "Residual Stresses Gradient Determination in Cu Thin Films", Materials Science Forum, Vols. 524-525, pp. 595-600, 2006
Online since
September 2006
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Price
$32.00
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