Scratch Test of TiCN Thin Films with Different Preferred Orientation |
| Journal |
Materials Science Forum (Volumes 524 - 525) |
| Volume |
Residual Stresses VII |
| Edited by |
W. Reimers and S. Quander |
| Pages |
729-734 |
| DOI |
10.4028/www.scientific.net/MSF.524-525.729 |
| Online since |
September, 2006 |
| Authors |
Hiroshi Goto, Masahide Gotoh, Shouichi Ejiri, Yoshiaki Horimoto, Yukio Hirose |
| Keywords |
Bias Voltage, Preferred Orientation, Residual Stress, Scratch Test, Thin Film |
| Abstract |
The purpose of this study is to examine the effect of crystallite preferred orientation on the
mechanical strength of TiCN thin films in highly compressive residual stress. TiCN thin films were
deposited by PVD on JIS-SKH55 (AISI M35) steel. The applied substrate bias voltages were set for
–50, -80, -100, -120 and –150V. Subsequently, residual stress and crystalline preferred orientation of
these specimens were investigated by X-ray diffraction methodology. The crystalline preferred
orientation in thin films was evaluated by the ODF calculated from pole figures. On the other hand,
dynamic hardness test (DH) and scratch test were executed to evaluate the mechanical strength of thin
films.
In our study, it was observed that negative bias voltages had an effect on the preferred orientation. The
orientation density at –120V was the highest of all specimens. In addition, the value of scratch section
area at –120V was the largest of all specimens. As a conclusion, the relation between the scratch area
and the negative bias voltages corresponded to the relation between the preferred orientation and the
bias voltages. |
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