Paper Title:
Evaluation of Deformation Behavior in Cu Thin Film under Tensile and Fatigue Loading by X-Ray Method
  Abstract

Two kinds of electrodeposited copper foils (thickness is 8 and 20 μm) were loaded statically, and the deformation behavior was observed. In-situ X-ray stress measurement was carried out under tensile loading. Fatigue tests were also conducted to observe the effect of the thickness on the fatigue strength. Change in the line broadening with stress cycles was observed to evaluate the fatigue damage. The tensile strength of 8 μm foil was higher than that of 20 μm foil. When the foils were loaded within elastic region, the stress measured by the X-ray method agreed with applied stress. When the plastic deformation occurred, difference between the measured stress and the applied stress became large. The difference of 20 μm foil was larger than that of 8 μm foil. Fatigue strength of 8 μm foil was also higher than that of 20 μm foil. The value of the full width at half maximum, FWHM, increased rapidly at the first cycle, and then the value became nearly constant. Just before fracture, the value increased again. The change in FWHM corresponded to the change in the accumulated ratchet strain.

  Info
Periodical
Materials Science Forum (Volumes 524-525)
Edited by
W. Reimers and S. Quander
Pages
807-812
DOI
10.4028/www.scientific.net/MSF.524-525.807
Citation
Y. Akiniwa, T. Suzuki, K. Tanaka, "Evaluation of Deformation Behavior in Cu Thin Film under Tensile and Fatigue Loading by X-Ray Method", Materials Science Forum, Vols. 524-525, pp. 807-812, 2006
Online since
September 2006
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Price
$32.00
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