Paper Title:
Mechanical Testing of Flexible Silicon Carbide Interconnect Ribbons
  Abstract

This paper explores polycrystalline 3C-silicon carbide (poly-SiC) deposited by LPCVD for fabricating flexible ribbon cable interconnects for micromachined neural probes. While doped silicon is used currently, we hypothesized that poly-SiC will provide enhanced mechanical robustness due to SiC’s superior mechanical properties. Paralleling prior work in silicon, forty-two different designs were fabricated from nitrogen-doped poly-SiC films deposited by LPCVD at 900°C using dichlorosilane and acetylene as precursors. The different designs were then tested in bending and twisting modes. Curved beams were found to bend nearly 250% more than straight beams before fracture. Longer beams withstood greater bending and twisting due to greater compliance. Longer and narrower beams generally outperformed shorter beams irrespective of design. Also, doped poly-SiC beams had, on average, breaking angles that were greater than those of identical doped silicon beams by ~50% in bending and ~20% in twisting modes. The paper details the designs studied, describes the fabrication process for the test structures and compares/contrasts the testing and simulation results related to the different designs to identify best design practices.

  Info
Periodical
Materials Science Forum (Volumes 527-529)
Edited by
Robert P. Devaty, David J. Larkin and Stephen E. Saddow
Pages
1107-1110
DOI
10.4028/www.scientific.net/MSF.527-529.1107
Citation
R. Panday, X. A. Fu, S. Rajgopal, T. Lisby, S.A. Nikles, K. Najafi, M. Mehregany, "Mechanical Testing of Flexible Silicon Carbide Interconnect Ribbons", Materials Science Forum, Vols. 527-529, pp. 1107-1110, 2006
Online since
October 2006
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Price
$32.00
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