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Homoepitaxial Growth of 4H-SiC Using a Chlorosilane Silicon Precursor

Journal Materials Science Forum (Volumes 527 - 529)
Volume Silicon Carbide and Related Materials 2005
Edited by Robert P. Devaty, David J. Larkin and Stephen E. Saddow
Pages 175-178
DOI 10.4028/www.scientific.net/MSF.527-529.175
Citation Mike F. MacMillan et al., 2006, Materials Science Forum, 527-529, 175
Online since October, 2006
Authors Mike F. MacMillan, Mark J. Loboda, Gil Yong Chung, E.P. Carlson, Jian Wei Wan
Keywords Chlorosilane, Hot-Wall CVD, SiC Epitaxy
Abstract

Epitaxial growth of SiC films was performed on 4H SiC n+ substrates utilizing a chlorosilane/propane chemistry in both single wafer and batch CVD systems. Variations of the chlorosilane flow under fixed conditions of gas composition, temperature and pressure resulted in growth rates between 4 to 20 μm/hr. Fixing the chlorosilane flow rate to achieve a growth rate of approximately 4 μm/hr, the effects of temperature, pressure and gas composition on background dopant incorporation, epitaxial layer uniformity and epitaxial defect generation were investigated. Intentional n and p-type doping has been demonstrated over the carrier range 1×1018-1×1020/cm3. This paper presents the first reported of use of chlorosilane precursors to grow high quality undoped, n and p doped SiC epilayers.

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