Paper Title:
Characterization of Stacking Fault-Induced Behavior in 4H-SiC p-i-n Diodes
  Abstract

Formation of I1 Shockley stacking faults by recombination-enhanced defect glide in 4HSiC p-i-n diodes subject to high forward current stress is studied in diodes on both c-oriented and aoriented substrates. The forward voltage increases during stressing for both orientations, accompanied by nucleation and expansion of faults visible in electroluminescence (EL) imaging. Low temperature photoluminescence (PL) measurements on degraded diodes of both orientations reveal the same set of exciton peaks, confirming that the electronic structure of the faults is the same in both cases. The spectroscopic data are compared to self-consistent solutions of the Schrödinger and Poisson equations including polarization charge. Dislocations nucleating the faults are bright in EL images but dark in electron beam-induced current (EBIC) imaging, confirming that they are sites of enhanced radiative recombination.

  Info
Periodical
Materials Science Forum (Volumes 527-529)
Edited by
Robert P. Devaty, David J. Larkin and Stephen E. Saddow
Pages
363-366
DOI
10.4028/www.scientific.net/MSF.527-529.363
Citation
Y. Wang, L. Chen, M.K. Mikhov, G. Samson, B.J. Skromme, "Characterization of Stacking Fault-Induced Behavior in 4H-SiC p-i-n Diodes", Materials Science Forum, Vols. 527-529, pp. 363-366, 2006
Online since
October 2006
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Price
$32.00
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